JPH0232110B2 - - Google Patents
Info
- Publication number
- JPH0232110B2 JPH0232110B2 JP59240225A JP24022584A JPH0232110B2 JP H0232110 B2 JPH0232110 B2 JP H0232110B2 JP 59240225 A JP59240225 A JP 59240225A JP 24022584 A JP24022584 A JP 24022584A JP H0232110 B2 JPH0232110 B2 JP H0232110B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- workpiece
- surface plate
- polishing cloth
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59240225A JPS61117064A (ja) | 1984-11-14 | 1984-11-14 | 両面ポリシング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59240225A JPS61117064A (ja) | 1984-11-14 | 1984-11-14 | 両面ポリシング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61117064A JPS61117064A (ja) | 1986-06-04 |
JPH0232110B2 true JPH0232110B2 (en]) | 1990-07-18 |
Family
ID=17056307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59240225A Granted JPS61117064A (ja) | 1984-11-14 | 1984-11-14 | 両面ポリシング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61117064A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009088027A (ja) * | 2007-09-27 | 2009-04-23 | Sumco Techxiv株式会社 | 半導体ウェハの両面研磨方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03117559A (ja) * | 1989-09-28 | 1991-05-20 | Shin Etsu Chem Co Ltd | 高平坦度基板の製造方法および研摩機 |
JP3960635B2 (ja) * | 1995-01-25 | 2007-08-15 | 株式会社荏原製作所 | ポリッシング装置 |
USRE39262E1 (en) * | 1995-01-25 | 2006-09-05 | Ebara Corporation | Polishing apparatus including turntable with polishing surface of different heights |
JP4448766B2 (ja) * | 2004-12-08 | 2010-04-14 | 信越化学工業株式会社 | 研磨方法 |
CN110281105B (zh) * | 2019-07-24 | 2024-10-01 | 蓝思科技股份有限公司 | 一种磨皮抛光设备和磨皮抛光棒 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5374792U (en]) * | 1976-11-25 | 1978-06-22 | ||
JPS5420494A (en) * | 1977-07-15 | 1979-02-15 | Nippon Telegr & Teleph Corp <Ntt> | Polisher for surface processing |
JPS6031627B2 (ja) * | 1980-09-09 | 1985-07-23 | 松下電器産業株式会社 | 両面研磨装置 |
-
1984
- 1984-11-14 JP JP59240225A patent/JPS61117064A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009088027A (ja) * | 2007-09-27 | 2009-04-23 | Sumco Techxiv株式会社 | 半導体ウェハの両面研磨方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS61117064A (ja) | 1986-06-04 |
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